Influence of the Power Semiconductor Packaging on the Failure Characteristic for Safety-Critical Applications

Abstract:
The packaging of power semiconductors determines their failure characteristic. Wire-bonded modules fail with an undefined state reaching from not ideal short-circuit to explosion of the module depending on the failure energy. In contrast, an ideal short-on failure characteristic is known for presspack and sandwich structure modules. Safety-critical applications like the discharging of energy sources, e.g. fuel cells, require an ideal short-on failure characteristic. A minimum failure energy is necessary to reach this ideal failure state and a maximum failure energy must not be exceeded in order to avoid severe mechanical destruction. Therefore, the failure characteristic depending on packaging and energy is investigated by destruction tests.