Progress of High Power Multilevel Converters: Combining Silicon and Silicon Carbide
Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2017
Pages: 7Language: englishTyp: PDF
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Authors:
Dahmen, Christopher; Marquardt, Rainer (University of the Federal Armed Forces Munich, Germany)
Abstract:
At present, Modular Multilevel Converter (MMC) are applied mainly for HVDC and are developed for future HVDC-Grids and Large Drives. While Half- Bridge submodules were preferred – because of lower losses and expenses – fully electronic fault management and protection will become a key requirement for future systems. A new submodule topology for MMC is presented, combining Si- and SiC-Switches, which meets these requirements and enables essentially reduced power losses.