Advanced IGBT and Packaging Technologies for Next Generation High Power Applications
Conference: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/27/2017 - 06/29/2017 at Shanghai, China
Proceedings: PCIM Asia 2017
Pages: 9Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Tsyplakov, Evgeny; Dugal, Franc; Rahimo, Munaf; Kopta, Arnost; Chen, Makan; Fischer, Fabian; Hartmann, Samuel (ABB Switzerland Ltd, Semiconductors, Switzerland)
This paper gives an overview of the latest achievements in the area of Si-based turn-off devices for high voltage applications in the power range beyond 10MW. In this paper, we will show an overview of our latest results covering high voltage IGBT/BiGT device and packaging technologies intended for demanding high power converters such as grid, traction, renewables and industrial applications.