A Double-Sided Cooling Package Design with Pinfin
Conference: PCIM Asia 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/27/2017 - 06/29/2017 at Shanghai, China
Proceedings: PCIM Asia 2017
Pages: 7Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Ning, Puqi (Key Laboratory of Power Electronics and Electric Drive,Institute of Electrical Engineering, Chinese Academy of Sciences, University of Chinese Academy of Sciences, China)
Wen, Xuhui (Collaborative Innovation Center of Electric Vehicles in Beijing, China)
A packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. The power switches in a popular phase-leg electrical topology are combined with pinfin structure for double-sided cooling.