Directly Cooled HybridPACK Power Modules with Ribbon Bonded Cooling Structures
Conference: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/05/2018 - 06/07/2018 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2018
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Uhlemann, Andre; Hymon, Erwin (Infineon Technologies AG, Germany)
In this paper a new way of direct fluid cooling for power modules is presented. The cooling concept uses flat base plates with ribbon bonded cooling structures. It is characterized by high flexibility and a thermal performance being comparable to conventional pin fin base plates. Furthermore the electrochemical compatibility of the new cooling concept and its flexible thermal design are demonstrated in detail.