4.5 kV Rupture Resistant Press Pack IEGT

Conference: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/05/2018 - 06/07/2018 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2018

Pages: 4Language: englishTyp: PDF

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Kotani, Raita; Nitta, Tetsuya; Tsukamoto, Naoto; Kitazawa, Hideaki; Kitagawa, Motoaki; Kawano, Tomohiro (Toshiba Electronic Device & Storage Corporation, Japan)
Tchouangue, Georges (Toshiba Electronics Europe GmbH, Germany)

In this paper, a 4.5kV class Press Pack IEGT (PPI) with an improved rupture resistance is presented. That capability is not only achieved by increasing the thickness of the ceramic package, but also by optimizing the parts inside the package. The vacant space ratio is also important to ease up the explosion pressure. The rupture resistance of the new package could achieve 13.3 MA 2 sec which is 1.7 times of that of the conventional package.