Evaluation of Ag-sinter and CuSn-TLP Based Joining Technologies on Lead Frame
Conference: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/05/2018 - 06/07/2018 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2018
Pages: 8Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Otto, Alexander; Schroeder, Tim; Dudek, Rainer; Wang, Wei-Shan; Baum, Mario; Wiemer, Maik; Doering, Ralf; Kurian, Jyothi Jennifer; Rzepka, Sven (Fraunhofer Institute for Electronic Nano Systems ENAS, Germany)
Murayama, Kei; Oi, Kiyoshi; Koyama, Tetsuya (Shinko Electric Industires Co., Ltd., Japan)
In this paper, Ag-sinter and CuSn-transient liquid phase based joining technologies for attaching power die to lead frame are investigated. The fo-cus will be set on the evaluation of the process pa-rameters, such as sinter temperature and bonding pressures, with respect to their reliability. For this reason, characterization of the intermediate bond-ing layer and of the bonded die were performed and power cycling tests in conjunction with finite element analysis were conducted. The results will be detailed within the paper and compared with classical PbSn-solder joint technologies.