Application of MMC AISiC Thermocompensators in Power Press Pack Diodes and Thyristors
Conference: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/05/2018 - 06/07/2018 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2018
Pages: 4Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Grishanin, Alexey; Martynenko, Valentin; Eliseev, Vyacheslav; Malygin, Mikhail; Samoylov, Anton; Nishchev, Konstantin (JSC Electrovipryamitel, Russia)
Novopoltsev, Mikhail; Plotnikov, Alexander (Mordovia State University, RU)
This paper presents investigation and test results of power press–pack semiconductors with thermocompensators from metal-matrix composite (MMC) AlSiC and brief description of design and manufacturing technology.