Application of MMC AISiC Thermocompensators in Power Press Pack Diodes and Thyristors

Conference: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/05/2018 - 06/07/2018 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2018

Pages: 4Language: englishTyp: PDF

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Grishanin, Alexey; Martynenko, Valentin; Eliseev, Vyacheslav; Malygin, Mikhail; Samoylov, Anton; Nishchev, Konstantin (JSC Electrovipryamitel, Russia)
Novopoltsev, Mikhail; Plotnikov, Alexander (Mordovia State University, RU)

This paper presents investigation and test results of power press–pack semiconductors with thermocompensators from metal-matrix composite (MMC) AlSiC and brief description of design and manufacturing technology.