PCB-Embedding of Power Dies Using Pressed Metal Foam
Conference: PCIM Europe 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/05/2018 - 06/07/2018 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2018
Pages: 8Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Pascal, Yoann; Labrousse, Denis; Petit, Mickael; Lefebvre, Stephane (SATIE, École normale supérieure Paris-Saclay, Cachan 94230, France & SATIE, Conservatoire National des Arts et Métiers, Paris 75003, France)
Costa, Francois (SATIE, École normale supérieure Paris-Saclay, Cachan 94230, France & SATIE, Université Paris Est Créteil, 94000 Créteil, France)
This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of metal foam. The manufacturing process is detailed, prototypes are manufactured and electrically characterized, and the technique is used to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.