Best fit between baseplate geometry and ceramic thickness to achieve excellent thermal performance
Conference: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/26/2018 - 06/28/2018 at Shanghai, China
Proceedings: PCIM Asia 2018
Pages: 4Language: englishTyp: PDF
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Authors:
Shen, Song; Zheng, Ziqing (Infineon Technologies Co., Ltd., China)
Zhao, Jia (Infineon Integrated Circuit (Beijing) Co., Ltd., China)
Abstract:
With the electrification of vehicles, the increasing demand for renewable energies and the need to reduce energy consumption, the demand for power electronics is increasing. To satisfy this demand, it is important to offer IGBT modules composed of materials from multiple sources and with similar cost-performance ratios to allow greater flexibility for customers. In this publication, a comparison between two different EconoDUAL(TM) 3 modules with different ceramic and baseplate geometry is presented.