Investigation of power cycling capability of a novel Cu wire bonded interconnection system
Conference: PCIM Asia 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/26/2018 - 06/28/2018 at Shanghai, China
Proceedings: PCIM Asia 2018
Pages: 6Language: englishTyp: PDF
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Authors:
Jiang, Nan; Lutz, Josef (Chemnitz University of Technology, Chemnitz, Germany)
Miric, Anton-Zoran; Klein, Andreas Steffen; Hinrich, Andreas; Fabian, Benjamin; Kalajica, Marko (Heraeus Deutschland GmbH, Hanau, Germany)
Becker, Martin (Danfoss Silicon Power GmbH, Flensburg, Germany)
Abstract:
In previous studies, significant improvements of thermal/electrical performance and power cycling capability were achieved by bonding Cu wires on the metal foil sintered on the top of the chip. However, factors such as the material properties and fabrication processes which may influence the power cycling capability are not fully investigated. In this work, power cycling tests were performed for the Cu wires bonded samples with the assist of the Die Top System (DTS(TM), Heraeus Electronics). The power cycling performance showed a significant increase of at least 67 times compared to soldered samples bonded with Al wires at the test conditions of DeltaTj = 130 K and ton = 1 s. The influence of the copper foil and the type of sinter material on the reliability performance was investigated. In addition, a new failure mechanism in the aluminum metallization on the chip top-side was observed.