Miniaturized Electronic Modules for Aggressive Environments
Conference: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
04/10/2019 - 04/11/2019 at Barcelona, Spain
Proceedings: SmartSystems Integration
Pages: 7Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Bihler, Eckardt; Hauer, Marc (DYCONEX AG, Bassersdorf, Switzerland)
Liquid Crystal Polymer (LCP), a thermoplastic dielectric film material with very low water absorption (< 0.04%), high chemical stability and low thermal expansion is best suited both as a substrate material and as the encapsulate for small miniaturized electronic modules. LCP stands out among other polymer materials used for microelectronics. The permeability for water and gases is the lowest among all polymeric materials. With proper design considerations LCP packages can achieve a sufficient hermeticity for exposures in harsh environments.