Optimized Micro-Mounting and Hybrid Integration of RF Mixed- Signal Systems based on MID Technology
Conference: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
04/10/2019 - 04/11/2019 at Barcelona, Spain
Proceedings: SmartSystems Integration
Pages: 4Language: englishTyp: PDF
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Authors:
Wolf, Marius; Barth, Maximilian; Eberhardt, Wolfgang (Hahn-Schickard, Stuttgart, Germany)
Zimmermann, Andre (Hahn-Schickard, Stuttgart, Germany & University of Stuttgart, Institute for Micro Integration)
Geneiss, Volker; Hedayat, Christian (Fraunhofer ENAS, Paderborn, Germany)
Otto, Thomas (Fraunhofer Institute ENAS, Chemnitz, Germany)
Abstract:
As miniaturization is an important aspect in all areas of circuit technology, highest demands are placed on optimum space utilization and the reduction of material and production cost. MID (Molded Interconnect Devices or Mechatronic Integrated Devices) are already broadly used in consumer electronics antennas, automation, automotive and medical technology, however MID have unexploited potential for high-frequency and fast-paced systems in particular. This work will present the design and manufacturing process of MID for RF (Radio Frequency) applications and provide RF relevant characteristics for substrate materials used in the LPKF-LDS (r)(Laser Direct Structuring) process. Furthermore, characteristics of the circuits on the injection molded plastic part, optimization of vias and interconnection geometries for hybrid assemblies will be discussed.