Toward improved FOWLP manufacturing by using self-alignment process
Conference: Smart Systems Integration - 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems
04/10/2019 - 04/11/2019 at Barcelona, Spain
Proceedings: SmartSystems Integration
Pages: 4Language: englishTyp: PDF
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Authors:
Scherbaum, Sabine; Landesberger, Christof (Fraunhofer EMFT, Research Institution for Microsystems and Solid State Technologies EMFT, Munich, Germany)
Auer, Benedikt; Klingler, Hannes; Brandstaetter, Birgit (Besi Austria GmbH, Radfeld, Austria)
Brandl, Elisabeth; Bravin, Julian (EVG Group, St. Florian am Inn, Austria)
Abstract:
Self-alignment of dies has been demonstrated to have the potential for improving packaging related technological and manufacturing building blocks. This leads to a new approach for Fan-Out Wafer Level Packaging (FOWLP) manufacturing. An accuracy below 2 µm was achieved.