Relationship Between Bonding Properties and Porosity of Sintered Cu Bonding

Conference: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/07/2019 - 05/09/2019 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2019

Pages: 5Language: englishTyp: PDF

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Authors:
Nakako, Hideo; Ishikawa, Dai; Sugama, Chie; Kawana, Yuki; Negishi, Motohiro; Yanaka, Yuichi; Ejiri, Yoshinori (Hitachi Chemical Co., Ltd., Japan)

Abstract:
The sintered Cu bonding with different porosities ranging between 10 % and 33 % was obtained by varying bonding conditions, using three types of sintering Cu bonding pastes. The bonding reliability in the thermal cycle test (TCT) was compared between the sintered Cu bondings with different porosities, sintered Ag bonding, and high-lead solder. The bonding reliability in TCT improved as the porosity of the sintered Cu bonding layer decreased. The order of excellence of die-bonding materials in TCT was sintered Cu bonding with 18 % porosity > sintered Cu bonding with 27 % porosity > sintered Ag layer with 10 % porosity > high lead solder > sintered Cu bonding with 33 % porosity.