High temperature wireless packaging of SiC power device by organic-free die-attach material sintering
Conference: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/07/2019 - 05/09/2019 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2019
Pages: 7Language: englishTyp: PDF
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Authors:
Liu, Lei; Ren, Hui; Zou, Guisheng; Deng, Zhongyang; Zhao, Zhenyu (Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, China)
Abstract:
This paper presents a wireless packaging design for SiC power device in order to improve junction temperature (Tj) and high-power-density reliability. Organic-free die attach material was employed to bond Cu ribbon frame for lowering inductance and increasing service temperature. Long time power cycling test was performed (ton=20s, DeltaTj>20 ºC) to evaluate packaging reliability. Thermal stress induced cracks expanded over cycles and caused the final failure because of the different thermal expansion coefficient (CTE). This high-temperature packaging design should be suitable for HEV/EV, aerospace or other harsh environment applications.