Fast active cycling power test bench using dedicated modules assemblies for studying wire bond ageing
Conference: PCIM Europe 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/07/2019 - 05/09/2019 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2019
Pages: 7Language: englishTyp: PDF
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Authors:
Pellecuer, Guillaume; Huselstein, Jean-Jacques; Forest, Francois (IES, Université de Montpellier, CNRS, 860 Rue Saint Priest, 34095 Montpellier, France)
Chysochoos, Andre (LMGC, Université de Montpellier, CNRS, 860 Rue Saint Priest, 34095 Montpellier, France)
Bontemps, Serge (Microsemi Power Module Products, 26 Rue de Campilleau, 33520 Bruges, France)
Abstract:
This paper presents the design of specific samples dedicated to the test of power bond wires (300 µm diameter). The aim is to totally control the test conditions on each bond wire while reducing drastically the power consumption. The samples are integrated in a particular test bench that allows conducting easily ageing tests with an on-line monitoring. The main idea is to solder Power MOSFET dies used as heating sources on an Integrated Metallic Substrate having a high thermal impedance. First, the paper describes the design process, aided by Finite Element simulations. A second part focuses on the realization of the samples and of the test bench. Finally, the first ageing results are presented.