High power IGBT modules with new compact package
Conference: PCIM Asia 2019 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/26/2019 - 06/28/2019 at Shanghai, China
Proceedings: PCIM Asia 2019
Pages: 5Language: englishTyp: PDF
Personal VDE Members are entitled to a 10% discount on this title
Authors:
Ma, Xiankui; Song, Gaosheng (Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China)
Zhang, Xing (Hefei University of Technology, China)
Abstract:
With the development of power chips, the performance of power modules is improved for new generation modules. Besides power chip technology, package technology is important to realize and guarantee IGBT modules’ high performance. Then new compact package (LV100) is developed to satisfy high power converter application, including high power density, high thermal cycling lifetime, low stray inductance, easy paralleling connection, etc. Using these modules in parallel could improve the power ratings of power converters, like wind power converters, high power inverters, etc.