Development of Directly Liquid Cooled Integrated Substrate for Power Modules
Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland
Proceedings: PCIM Europe digital days 2020
Pages: 6Language: englishTyp: PDF
Authors:
Osanai, Hideyo; Yamamoto, Akio; Kobayashi, Koji (DOWA POWERDEVICE Co., Ltd., Japan)
Medick, Bernd (DOWA HD Europe GmbH, Germany)
Sugawara, Akira (DOWA METALTECH Co., Ltd., Japan)
Abstract:
The authors succeeded in high level integration of a metal ceramics substrate, a heat sink base plate and a cooler with cooling fins by investigation of appropriated materials, bonding methods and structures. This results in the directly liquid cooled Integrated Substrate which offers features of high-power density, high reliability and low weight. Moreover, according to the component integration and the elimination of thermal interfaces within the power module, cost for assembling could be significantly decreased.