XHPTM 2 – The low-inductive, multi-package housing for the next generation of high-power applications

Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland

Proceedings: PCIM Europe digital days 2020

Pages: 7Language: englishTyp: PDF

Authors:
Brekel, Waleri; Rusche, Wilhelm; Hoehn, Alexander; Buecker, Wolfgang (Infineon Technologies AG, Germany)

Abstract:
The harmonization of power electronic platforms for various urban transportation and their different operation voltages is one of the major requirements for future-oriented developments. In addition, new and upcoming technologies in switching devices like IGBT5/.XT or SiC MOSFETs in high-power applications make the increase of current density possible. As a result, size and volume have been reduced, advantages that support such harmonized platforms. A low-inductive, high-current and symmetrical power-module design fulfilling the requirements for both low and high operation voltages at the same time is needed. In this work we discuss the low-inductive concept of XHPTM 2 for high-power applications, switching characteristics, and the extended module lifetime with IGBT5/.XT technology.