High Temperature Packaging for Sensor Elements

Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland

Proceedings: PCIM Europe digital days 2020

Pages: 4Language: englishTyp: PDF

Rebenklau, Lars; Gierth, Paul; Barth, Henry (Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany)

Many industrial measurement tasks are facing increasing environmental temperatures up to 600 °C. Development of such kind of high temperature sensors require availability of temperature stable sensor elements (semiconductors, crystals), measuring principles as well as their packaging in suitable housings. The classic assembling technology of electronic packaging is reaching its limits concerning technological processes, thermal parameters, but also concerning the assembly materials itself. Therefore, existing connection technologies need to be evaluated and developed for higher operating temperatures. First works related to suitable housings and possible wire connection technologies have been presented at PCIM 2019. Aim of this work is to report examinations, which are related to the assembling of senor elements and the mechanical behavior of their mounting joints up to 600 °C.