Finding solder cavities in high power modules with temperaturesensitive parameters

Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland

Proceedings: PCIM Europe digital days 2020

Pages: 8Language: englishTyp: PDF

Fuhrmann, Jan; Eckel, Hans-Guenter (University of Rostock, Germany)
Klauke, Sebastian (Infineon Technologies AG, Germany)

The solder layers in power semiconductors are thin and unremarkable, yet essential for function and lifetime of a power module. They conduct the current, transmit the losses to the baseplate and cooler, and have to withstand mechanical tension. Therefore, the quality and the condition of the solder layers are important. Within this paper, several temperature-sensitive parameters are analyzed to determine solder cavities. For this, measurements are made to investigate the effect of solder cavity size on the electric parameters. Moreover, a simulation model is built to test different heating mechanisms and the resulting effect on the temperature-sensitive parameter.