New ST’s package TO-LL and MDmesh(TM) DM6: the right choice for high level SMPS

Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland

Proceedings: PCIM Europe digital days 2020

Pages: 7Language: englishTyp: PDF

Nardo, Domenico; Scuto, Alfio; Sorrentino, Giuseppe; Scollo, Rosario; Buonomo, Simone (STMicroelectronics, Italy)

This paper presents ST’s new TO-LL (TO-lead less) SMD package and its benefits in terms of thermal management, PCB area, switching performance and parasitic inductance on the leads. The evaluation begins with an overview of SMD packages, and concludes with an application analysis of SMPS, PFC and LLC stages. The combination of TO-LL and ST’s latest MDmesh(TM) DM6 super-junction technology increases efficiency with very small switch-off energy, best RDS(on) x area, reliability, robustness and an increase of power density.