Measurement of Temperature-Sensitive Parameters of SiC Power Semiconductors during Turn-Off using a Time-to-Digital Converter

Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland

Proceedings: PCIM Europe digital days 2020

Pages: 6Language: englishTyp: PDF

Authors:
Golev, Victor; Schnack, Jasper; Goerdes, Jan Philipp; Fleck, Soenke; Schuemann, Ulf (University of Applied Sciences Kiel, Institute for Electrical Power Engineering, Kiel, Germany)

Abstract:
This paper deals with the investigation on thermo-sensitive electrical parameters (TSEP) for silicon carbide (SiC) power semiconductors, which can be represented by the turn-off delay. The turn-off switching delay depends on several external parameters and characteristics of the semiconductor. Some regularities of these parameters are metrological proven in the paper. The paper gives a contribution to the development of condition monitoring systems for SiC-semiconductors e.g. in automotive inverter applications. It addresses the occurring problems and shows the implementation effort with a Time-to-Digital Converter (TDC). Finally, a method is presented which allows the recording of the turn-off delay during switching operation.