Low Shrinkage EMC (Epoxy Molding Compound)
Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland
Proceedings: PCIM Europe digital days 2020
Pages: 4Language: englishTyp: PDF
Authors:
Oh, Hwasuck; Park, Chan Young; Shim, MyongTaek; Kwon, YoungEun; Kong, Byung-Seon (KCC, Korea)
Abstract:
A new type of epoxy resin based EMC (Epoxy Molding Compound) was developed to relieve thermal stress of high temperature driving power module and improve the package anti-crack and warpage characteristics. The new epoxy resin was effective on improving warpage performance through a lower shrinkage rate at the same filler content. Also, package reliability can be improved by low modulus characteristics of newly developed EMC.