1600 A 1200 V PrimePACK(TM)2 with IGBT 7 for higher power density in drives application

Conference: PCIM Europe digital days 2020 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
07/07/2020 - 07/08/2020 at Deutschland

Proceedings: PCIM Europe digital days 2020

Pages: 8Language: englishTyp: PDF

Yilmaz, Koray; Patocki, Marius; Schmal, Andreas; Pfeiffer, Joscha; Brekel, Waleri (Infineon Technologies AG, Germany)

All developments in the power semiconductor technology strive for the reduction of losses, which in turn makes the increase of power density in the same package footprint possible. Especially for drives applications, the increased power density results in the reduction of cabinet size, or in other words, in the increase of power rating of inverters for the same footprint. This leads to performance improvement of the inverter, whilst keeping the system-based costs comparable. However, increasing power density in modules for the same footprint is a challenge for semiconductor development. This is especially the case if the inductance of the system stays constant, but at the same time, output current increases. This requires an improvement in the softness of power semiconductors; otherwise, undesired oscillations can take place. This is an even greater challenge if for the sake of downsizing, also the inductance of the package increases. This is the case for the new IGBT7 technology in PrimePACK(TM)2, which has to overcome the increased current density with higher system inductance in order to substitute the existing 1400 A 1200 V PrimePACK(TM)3 with IGBT4. This paper deals with the technical performance of the new TRENCHSTOP(TM) high-power IGBT7 and EC7 in PrimePACK(TM)2 housing for the drives application. Furthermore, the differences and advantages of the new 1600 A 1200 V PrimePACK(TM)2 will be explained.