Evaluation of Encapsulation Resin Structure for POL Tile
Conference: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/03/2021 - 05/07/2021 at Online
Proceedings: PCIM Europe digital days 2021
Pages: 6Language: englishTyp: PDF
Authors:
Murayama, Kei; Kaneko, Amane; Aizawa, Mitsuhiro; Fujisawa, Chiaki; Oi, Kiyoshi (Shinko Electric Industries Co., Ltd., Japan)
Abstract:
Demand for power modules is increasing year by year. In order to meet the demands of various power systems and cost reduction, it is required to develop a simple and small package that can share development resources. Power Overlay (POL) tile is small power module that has the potential to realize these demands. In this report, encapsulant and structure used for POL tile were studied, that is under fill process and molding process. It was found that the reliability was significantly improved by changing from underfill resin to mold resin.