L860: An NTC Thermistor Chip Suitable for Temperature Control in Power Modules
Conference: PCIM Europe digital days 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/03/2021 - 05/07/2021 at Online
Proceedings: PCIM Europe digital days 2021
Pages: 5Language: englishTyp: PDF
Authors:
Bernert, Thomas; Ihle, Jan; Kirsten, Lutz Heiner (TDK Electronics GmbH & Co OG, Deutschlandsberg, Austria)
Taubert, Thomas (TDK Sensors AG & Co KG, Berlin, Germany)
Supancic, Peter (University of Leoben, Leoben, Austria)
Abstract:
The efficiency of power modules is highest close to their power limits but to operate at these limits a precise power semiconductor die temperature control is essential. Historically, MELF-NTC’s are used but are limited in terms of contacting technology. A new lead free NTC chip (L860) offers established R=T characteristics (R100: 493 Ω) and can be used with sintering and Al-heavy wire bonding for operating temperatures up to 175 °C. Reliability of L860 was tested according to industrial and automotive standards (AEC-Q200). Additionally, mechanical tests are presented to study the strengths of the chip towards mechanical loads during heavy-wire bonding.