Direct-Liquid-Cooled Next High Power Density Dual (nHPD2) using Copper Base Plate
Conference: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2022 - 05/12/2022 at Nürnberg, Germany
doi:10.30420/565822097
Proceedings: PCIM Europe 2022
Pages: 7Language: englishTyp: PDF
Authors:
Nishimori, Hitoshi; Nakazato, Norio (Hitachi, Ltd. Research & Development Group, Japan)
Kushima, Takayuki; Sasaki, Koji; Saito, Katsuaki (Hitachi Power Semiconductor Device, Ltd., Japan)
Abstract:
A direct-liquid-cooled standard power module based on Hitachi’s next High Power Density Dual (nHPD2) adopting a copper base plate has been developed for the purpose of reducing inverter system cost. The water pressure resistance of the power module was improved to 0.4 MPa through reinforcement of the base plate surrounding the pin fin region. Thermal resistance of the direct-liquid-cooled nHPD2 was found to be reduced to less than 60% that of the conventional indirect-liquid-cooled nHPD2 and the rated current can be improved by 1.5 times. In the industrial application such as wind power generation the phase current can also be improved by more than 1.3 times. It shows that cost reduction can be achieved by reducing the number of power modules installed.