Improving the Performance of DC-DC Converters by Using SMDPackages with Top-Side Cooling
Conference: PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2022 - 05/12/2022 at Nürnberg, Germany
doi:10.30420/565822125
Proceedings: PCIM Europe 2022
Pages: 6Language: englishTyp: PDF
Authors:
Papaserio, Marco; Nardo, Domenico; Orlando, Stefano; Stella, Cristiano Gianluca; Cavallaro, Daniela (STMicroelectronics, Italy)
Abstract:
This paper analyzes the efficiency of silicon MOSFETs in SMD packages with top-side cooling compared to bottom-side cooling packages in terms of thermal performance, lowering both thermal resistance and operating temperatures. It will show how reducing the junction temperature helps to boost power efficiency due to a smoother variation of the main silicon MOSFET parameters due to temperature changes such as RDS(on) and Vth level as well as reduces total conduction and switching losses.