Epoxy Molding Compound Adhesion Analysis on Copper andNickel Surfaces Using In-Situ Button Shear Method

Abstract:
During this study, the effect of different molding compounds on adhesion was investigated using novel in-situ button shear technique and scanning acoustic microscopy. The molding process parameters were fine-tuned for each compound to achieve the most accurate results. The samples were prepared using copper substrate or nickel baseplate as the adherend. During the study it was found that EMC1 shows superior adhesion properties on Cu and Ni surfaces. It was shown that the adhesion on Ni surface is about 2.5 times lower than on Cu, similarly, the only bond failure mode detected was adhesive failure.