The Novel High Reliability Materials for Power Module

Abstract:
Power modules are semiconductor devices essential for power conversion and management, commonly utilized in applications such as electric vehicles (EVs) and renewable energy systems. With the global push for carbon neutrality, the demand for high-efficiency and reliable power modules has increased, driving the adoption of next-generation technologies like silicon carbide (SiC) and gallium nitride (GaN). These wide-bandgap semiconductors exhibit advantages such as high-speed switching, low power loss, high breakdown voltage, and the ability to operate at elevated temperatures. However, to fully leverage the potential of these semiconductors, the development of advanced packaging materials capable of withstanding high-temperature and high-voltage conditions is critical. This paper introduces innova-tions in epoxy molding compounds (EMC) and thermal interface materials (TIM). The EMC achieves a high glass transition temperature (Tg) of 200–240deg C, a low elastic modulus of 14 GPa, and a high comparative tracking index (CTI) of >600V, effectively preventing delamination and cracking while ensuring high electrical insulation. The TIM material combines a low thermal resistance of 2.5 mm²·K/W and an elastic modulus of 6 GPa, and can be easily applied using a non-pressurized, low-temperature process at 175deg C. These technological advancements contribute to enhanced reliability, energy efficiency, and cost reduction in next-generation power modules.