Double Injection-Based Plasma SPICE Modelingin IGBTs with High Carrier Confinement
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541010
Proceedings: PCIM Conference 2025
Pages: Language: englishTyp: PDF
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Authors:
Cotorogea, Maria; Biswas, Arnab; Türkes, Peter
Abstract:
Micro-pattern trench IGBT is the state-of-the-art technology for the new generation IGBT. This technol-ogy reduces losses significantly and offers a high level of controllability [1], but it also brings new challenges in physics-based compact modeling. The aim of this research is to present a new modeling approach for structures with high front-end carrier concentration. The new approach will considerably improve the modeling accuracy of the trade-off between the static and dynamic IGBT behaviors.