Parallelization of XHP(TM)2 CoolSiC(TM) 3.3 kV Devices

Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany

doi:10.30420/566541077

Proceedings: PCIM Conference 2025

Pages: Language: englishTyp: PDF

Personal VDE Members are entitled to a 10% discount on this title

Authors:
Fischer, Andreas; Buerger, Matthias; Car, Diana

Abstract:
This paper presents an investigation into the switching behavior of 3.3 kV CoolSiC(TM) XHP(TM)2 modules in parallel operation, focusing on key aspects of paralleled high-power silicon carbide (SiC) devices. The results reveal that the positive temperature coefficient (PTC) of the on-resistance is crucial for symmetrizing module variations and balancing both static and dynamic losses. This allows for parallel switching without the need for selection criteria. Random module selection is found to improve the thermal performance at a system level compared to symmetric selection. The results were verified through thermal simulations and experiments on a reference setup for paralleling and with the XHP(TM)2 PEBB demonstrator.