Wetting Force-Assisted Solvent-Drying Method for Large-Area, Low- or No-Pressure Sintering
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541118
Proceedings: PCIM Conference 2025
Pages: Language: englishTyp: PDF
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Authors:
Yamasaki, Masanao; Koseki, Katsuya; Doi, Shinsuke; Tadano, Akiyoshi; Yoshida, Isamu
Abstract:
Effective solvent drying is important for productivity and reliability during the sintering process, particularly in the case of large-area, low- or no-pressure sintering. Herein, we propose a solvent-drying method that utilizes the wetting force. Generally, rough surfaces enhance wettability. We hypothesized that the solvent would be actively drawn out along the surface by an increased wetting force, allowing faster solvent drying. In validation experiments, the proposed method reduced the voids caused by solvents that could not be fully dried and confirmed that roughened surfaces did not negatively affect the reliability of the sintered layer during a thermal shock test.