A New, Fully molded IPM with 7th Generation IGBTs and Diodes
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541130
Proceedings: PCIM Conference 2025
Pages: Language: englishTyp: PDF
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Authors:
Lee, Taejin; Song, BK; Lee, Jaewook; Jong, Mankyo; Choo, Byoungho; Laurent, Beaurenaut
Abstract:
This paper introduces the new generation CIPOS(TM) Mini intelligent power module (IPM) family. It integrates six IGBT7 switches, six emitter-controlled (EC7) diodes, and a 6-channel silicon-on-insulator (SOI) gate driver. The module provides high mechanical robustness thanks to its external and internal structure. The 7th generation IGBT and diode devices use the micro-pattern trench technology combined with improved softness characteristic, which results in reduced power losses. The upgraded mold body and lead-frame design improve robustness against mechanical stress. In this paper, the electrical and thermal performance of the device and its robustness against mechanical stress will be explained.