Thermal Performance of the New 600 V CIPOSTM Micro IPM for HVAC and Heat Pump Fan Motor Drive

Abstract:
This paper discusses the thermal performance of the new CIPOS(TM)Micro intelligent power module (IPM) in fan motor drive systems for heating, ventilation, air conditioning (HVAC), and heat pumps. It integrates the highly efficient TRENCHSTOP(TM) 2nd generation reverse conducting IGBT (RC-D2 IGBT) with its unique long-lead package design. The CIPOS(TM) Micro IPM can be attached directly to the main system heatsink instead of a separate heatsink. This has drastically improved the thermal performance of the system. This new approach improves the overall efficiency and compactness of the system, making it more cost effective. The design demand for superior heat dissipation and compact system size for the HVAC and heat pump fan motor is constantly evolving to improve system manufacturing costs and meet environmental guidelines. The new CIPOS(TM) Micro IPM implements the energy-effective power switch technology – TRENCHSTOP(TM) 2nd generation RC-D2 IGBT – in the world’s smallest package. Its thermal performance with fan motor drive structures using heatsink, is analyzed in this paper.