Integrity of Power Electronic Components on a Rotating PCB
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541139
Proceedings: PCIM Conference 2025
Pages: Language: englishTyp: PDF
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Authors:
Terzioglu, Furkan; Rongong, Jem; Odavic, Milijana; Betha, Hemanth V.; Atallah, Kais
Abstract:
This paper presents an initial study on the physical integrity of small power electronic components mounted on a rotating Printed Circuit Board (PCB) using solder-pin pairs. A practical approach, based on measured failure stress of the solder-pin pairs, is used to predict the rotational speeds – and corresponding inertial forces – at which components may lose their connection to the PCB. High-speed rotational tests of the PCB are conducted to validate the approach. Results indicate that the method provides conservative predictions for the failure of inertial loads of the components, ensuring a safety factor in practical applications.