Advancements in Formic Acid Soldering Materials Technology for Power Device Packaging

Abstract:
For high power devices, performance of interconnect materials within the packaging is critical to achieve efficiency and longevity. Formic acid soldering is proven and scalable technique to achieve ultra-low voiding, optimal RDS-on and thermal performance for active devices and interconnects within power modules [1],[2]. For this effort, a novel flux-free solder paste technology is evaluated for application in power discrete components and power modules with die-attach, interconnect, and component soldering. Empirical data is captured to characterize solder voiding performance, and demonstrate the scarcity of residue under industry-common reflow scenarios, as measured through TGA and surface analysis.