A Quantitative Method for the Development and Evaluation of Soldered Package Package-Attach Assembly in Power Electronics

Abstract:
When designing in a new solder solution, one must establish what testing can be done to ensure the new solution will meet the necessary performance and reliability requirements based on the mission profile of the application. While there are plenty of existing test methods and standards, this work is focused on the implementation of a fast, practical solder evaluation method focused on package or module attach in Power Electronics. Shear strength is a strong proof-of-concept criteria as it is a quantitative test method that can yield correlations to various characteristics such as solderability, wetting, delamination, thermal resistance and thermo-mechanical reliability.