Development and Characterization of a Surface-Mounted Device Qi-Compliant Wireless Power Coil

Abstract:
This paper describes the development of a Qi-compliant surface-mounted device (SMD) wireless power coil and the implementation and test of the developed coil in a wireless power transfer (WPT) system. To ensure the reliability of the developed coil, different standardized high temperature, moisture and vibration test procedures have been performed. One of the main challenges is to ensure the robustness of the developed coil through the high-temperature reflow soldering process. The main objective was to develop a system for WPT, which enables the usage of the developed SMD coil on the transmitter and receiver side. Finally, the performance of the developed system using the SMD coil is compared to the Würth Elektronik (WE) 200 W design using a comparable through-hole technology (THT) coil with a similar design. The SMD coil design has been filed as a patent.