Planar Integration of High Current Measurement Shunts in Die on Lead Frame Power Modules
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541327
Proceedings: PCIM Conference 2025
Pages: Language: englishTyp: PDF
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Authors:
Hennig, Christian; Bast, Markus; Gripp, Knud; Bicakci, Aylin
Abstract:
In low voltage power modules, the current measurement of the load paths is often realized by shunt bridges. This form of shunt integration has a low degree of integration and a bad thermal connection. This paper shows lateral shunt integration into the layout using the Die on lead frame (DoL) technology. This kind of integration enables the direct cooling of shunt resistors and higher integration into the DoL layout. The improved thermal cooling of the lateral shunts enables higher currents than conventional shunts, which saves costs and material. The low temperature increase enables more accurate measurements.