Optimization Potential for Lifetime-Oriented Junction Temperature Control Considering Predicted Load Cycles

Abstract:
Power semiconductor modules are heavily impacted by thermal stress due to junction temperature fluctuations, which reduces their lifetime. Junction temperature control systems can reduce the thermal stress by mitigating these fluctuations, however they face limitations in their adjustment range, why suitable control strategies must be developed. This paper demonstrates the benefits of predicted load cycles to enhance temperature control strategies. By incorporating future load conditions into control strategies, thermal stress can be reduced more effectively. The proposed strategies extends the lifetime of power semiconductor devices while balancing efficiency, presenting a novel approach for lifetime-oriented temperature control in power electronics.