Device Level Degradation Due to Power Cycling Test in SiC Power Module

Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany

doi:10.30420/566541340

Proceedings: PCIM Conference 2025

Pages: Language: englishTyp: PDF

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Authors:
Yoo, Dahui; Kim, Kihyun; Kang, Inho

Abstract:
This study examined whether SiC Trench MOSFET power modules could experience chip-level degradation due to bias temperature stress factors during Power Cycling Tests. IV characteristic curves and Gate Charge curves were measured for intrinsic and power cycled devices. These measurements were compared with results from Positive/Negative Bias Temperature Stress. The Transfer Curve shifted to the right, and the threshold voltage increased. In the Gate Charge curve, an increase in Miller Plateau Voltage was observed. These electrical characteristic changes correspond to those caused by Positive Bias Temperature Stress. The results demonstrate that power cycling tests can induce chip-level degradation to SiC power modules.