A Study on Power Dissipation and Thermal Resistance of Liquid- Immersion Cooled SiC Power Modules
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541369
Proceedings: PCIM Conference 2025
Pages: 8Language: englishTyp: PDF
Authors:
Ferreira, C.; Ali, A.; Graham, D.; De, M.; Fjer, M.; Bowkett, M.; Chandrappan, J.; Ludtke, I.; Calderon-Lopez, G.
Abstract:
Liquid-immersion cooling can increase the power density of switch mode power supplies in data centres and the excess heat can be utilised for other purposes. This paper studies the power dissipation capabilities and the junction-to-case thermal resistance of a SiC power MOSFET module immersed in a dielectric coolant. Using extensive 3D CFD thermal simulations in ANSYS and a dual-sided cooled halfbridge module, it is shown that a dissipation of 400 W/cm2 is possible in a single-phase cooling system with natural convection, and close to 600 W/mm2 under forced convection conditions. This alternative approach is a step towards the development of fully immersed power-dense switch mode power supply. Experimental results of the power dissipation and measured thermal resistances are provided.