Large-area Ag Sintering (40 mm × 51 mm) Application for Trans-fer Molded Power Module and Al Cooler
Conference: PCIM Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/06/2025 - 05/08/2025 at Nürnberg, Germany
doi:10.30420/566541371
Proceedings: PCIM Conference 2025
Pages: Language: englishTyp: PDF
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Authors:
Seo, Ryotaro; Ishihara, Takayuki; Sato, Oji; Hayashi, Kenji
Abstract:
In this paper, we show the large-area Ag sintering technology for transfer molded power modules onto the heatsink. Here, a power module with an Ag plated backside was attached to an Ag coated Al plate with 5 mm thickness that simulates a heatsink. Even after 2,000 cycles of thermal shock test, no resin delamination was observed inside the module by selecting a resin with a glass transition temperature higher than the sintering temperature. Although 16.1% delamination was observed in the sintered layer between module and plate, it had little effect on thermal resistance. These results suggest that the Tg of a resin is an important parameter that determines the quality of power module.