The new intelligent power module, CIPOS (exp TM) Mini DCB IPM with 7th generation IGBTs for motor drive applications
Conference: PCIM Asia Shanghai Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09/24/2025 - 09/26/2025 at Shanghai, China
doi:10.30420/566583016
Proceedings: PCIM Asia Shanghai Conference 2025
Pages: 3Language: englishTyp: PDF
Authors:
Bokkeun, Song; Jonguk, Lee; Kihyun, Lee; Taejin, Lee; David, Jo
Abstract:
This paper introduces the new generation CIPOS(TM) Mini family. It is an intelligent power module (IPM) dual in-line package with transfer molding for 3-phase AC motors, and permanent magnet motors in variable speed motor drives applications. The CIPOS(TM) Mini integrates the 650 V rated IGBT 7, emitter controlled 3 (EC 3) diodes, a 6-channel silicon-on-insulator (SOI) gate driver, and protection circuit in a dual in-line, direct copper bonding (DCB) transfer-molded package. It uses 7th generation TRENCHSTOPTM IGBTs with micro-pattern trench technology that offer reduced losses, improved efficiency, and higher power density compared to previous versions.