Investigation of Large Area Solder with TrueHeight(exp TM) Preform on Bare Cu Substrates
Conference: PCIM Asia Shanghai Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09/24/2025 - 09/26/2025 at Shanghai, China
doi:10.30420/566583026
Proceedings: PCIM Asia Shanghai Conference 2025
Pages: 5Language: englishTyp: PDF
Authors:
Hu, Liuchang; Hong, Damon; Zhang, Alicia; Wang, Marvin; Fenech, Maurizio
Abstract:
This paper investigates the solder performance of different commercial and MacDermid Α TrueHeight(exp TM) solder preforms with large area AMB vacuum solder on bare Cu substrates in terms of T0 and 1000 TS reliability. The soldered assemblies are initially characterized with X-Ray for void percentage and CSAM for delamination check. Cross sections of soldered parts are conducted and interface IMC BLT together with solder body crystal morphology are characterized. Results demonstrate excellent solder performance in large area solder application fields using MacDermid Α Solder preforms with the patented TrueHeight(exp TM) technology.