Multi-functional Chip Contributes to the Compact Design of Automotive SiC Power Module

Conference: PCIM Asia Shanghai Conference 2025 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
09/24/2025 - 09/26/2025 at Shanghai, China

doi:10.30420/566583064

Proceedings: PCIM Asia Shanghai Conference 2025

Pages: 5Language: englishTyp: PDF

Authors:
Zhao, Lizhong; Huang, Hongguang; Yoshida, Kentaro

Abstract:
With the rapid development of the electric vehicle industry, the performance requirements for electric drive units are increasing day by day. Traditional Si-based semiconductor materials have gradually reached their physical limits, and it is difficult to meet the market demand for high-power-density and high-efficiency electric drive units. SiC (silicon carbide) materials have become the key material to improve the performance of electric drive units due to their excellent performance advantages. The purpose of this paper is to explore the application of Mitsubishi Electric’s latest J3 series SiC modules in electric vehicle. This article first introduces J3 series SiC modules, which will be mass-produced, and then elaborates on Mitsubishi Electric's original design, multi-functional chip, which can help to decrease the size of power module. Finally, through comparative analysis, the superiority of the J3 series SiC power module in improving the size of the electric drive system is verified.