3D Wiring Technology Development for Power Modules to Achieve High Power Density

Abstract:
A new wiring technology as called 3D wiring structure was developed to achieve low loss and high power density on SiC modules. To obtain the effect of both low inductance and high power density was achieved by adopting a 3D wiring structure using circuit boards with multiple circuit layers and Cu pins interconnection instead of the conventional Cu clip wiring [1]. This paper describes the result of inductance, switching losses and DeltaTvj power cycling test by utilizing the 3D wiring structure. As results show, the 3D wiring structure has achieved 56% reduction in switching losses, doubled power density and 5 times higher number of cycles to failure compared to the conventional Cu clip structure.